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SEMI M1-0211 (technical revision)
The results of this Test Method provide information on the level of module protection provided by the packaging design
SEMI E35-1022 (technical revision)
欠陥に関する用語をレビューし，必要に応じて適合させる。
Part 3 of the Silicon Wafer Specification Format for Order Entry
G01900 - SEMI G19 - エッチングにより製造されるDIPリードフレームのための仕様 StdTpc-Gallium Arsenide SEMI M1-0211 (technical revision)global Assembly & Packaging Technical Committee201171global Audits and Reviews Subcommittee20118www. semiviews. org www. semi. org19801997 : DIP Referenced SEMI Standards SEMI G10 Standard Method for Mechanical Measurement of Plastic Package Leadframes SEMI G18 Specification for Integrated Circuit Leadframe Material Used in the Production of Etched Leadframes
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