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G08700 - SEMI G87 - Specification for Plastic Tape Frame for 300 mm Wafer Revision:SEMI G87-1108 (Reapproved 0215) - Superseded 4-1022 (first published)

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Description

4-1022 (first published)

The purpose of this Document is to define terminology and to recommend minimum periods for the shelf lives of specialty gases

2 dichloroethylene for which a need has been identified

due to the migration to large substrate sizes in FPD production

1-0226 — Specification for SECS-II Protocol for Control Job Management (CJM)

G08700 - SEMI G87 - Specification for Plastic Tape Frame for 300 mm Wafer Revision:SEMI G87-1108 (Reapproved 0215) - Superseded 4-1022 (first published)The purpose of this Document is to standardize the specification of a plastic tape frame, for a 300 mm wafer, which is used between the dicing process and the die bonding process, and for the handling and shipping of wafers. This Specification is applicable to plastic tape frames for 300 mm wafers. This Standard puts in writing the dimensions, mechanical characteristics and measurement method for the 300 mm wafer tape frame. This Standard can be used

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