Semiconductor devices. Micro-electromechanical devices - Electromechanical tensile test method for conductive thin films on flexible substrates Ingestion-build-53008 BS EN 12561-4 applies to

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Semiconductor devices. Micro-electromechanical devices - Electromechanical tensile test method for conductive thin films on flexible substrates Ingestion-build-53008 BS EN 12561-4 applies to1 Scope This part of IEC 62047 specifies a tensile test method to measure electromechanical properties of conductive thin micro electromechanical systems (MEMS) materials bonded on non conductive flexible substrates. Conductive thin film structures on flexible substrates are extensively utilized in MEMS, consumer products, and flexible electronics. The electrical behaviours of films on flexible substrates differ from those of freestanding films and