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Future of AI Computing: Bending the Curve for Radical Efficiency Improvement StdPbc-0221 Describe how through hole technology

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Description

Describe how through hole technology and wave soldering functions

Flexible Hybrid Electronics 2

Presents important considerations when designing flexible and printable parts and circuits

·     Registrants may cancel or reschedule a class no less than 30 days before the class start date

based on the electrochemical critical pitting temperature (CPT)

Future of AI Computing: Bending the Curve for Radical Efficiency Improvement StdPbc-0221 Describe how through hole technologyFor more information about the workshop, please visit: Future of AI Computing Cancellation Policy: Cancellation request received on or before August 12 will be eligible for a refund. After this date, only substitutions will be accepted. Please email your cancellation request to Agnes Cobar at acobar@semi. org. Substitutions will only be accepted with written permission from the originally registered attendee. Event Contact: Pushkar Apte Email:

Exchange/Return Notes
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