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G00400 - SEMI G4 - Specification for Integrated Circuit Leadframe Materials Used in the Production of Stamped Leadframes Revision:SEMI G4-0302 - Superseded Terminology for Through Silicon Via

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Description

Terminology for Through Silicon Via Metrology

many of the old calibration factors remain in common use throughout the industry

Because of this

This Standard can be used as a specification when purchasing these solder spheres

SEMI E134-0924 (technical revision)

G00400 - SEMI G4 - Specification for Integrated Circuit Leadframe Materials Used in the Production of Stamped Leadframes Revision:SEMI G4-0302 - Superseded Terminology for Through Silicon ViaNOTICE: This Standard or Safety Guideline has an Inactive Status because the conditions to maintain Current Status have not been met. Inactive Standards or Safety Guidelines are available from SEMI and continue to be valid for use. This Specification covers the special requirements for a metal strip to be used to fabricate integrated circuit leadframes by stamping. Referenced SEMI Standards (purchase separately) None. Revision History SEMI G4 0302

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